What is better, thermal pad or thermal grease or thermal pad?

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vortmax said:
Tested at 4 GHz, but that's not it's strong point. Developers calim it can breech the Terraflop boundary. That's a trillion floating point opperations per second or 10000000000000 flops.

It's comprised of 8 32 bit SPE processors linked by a blazing fast bus routed through a 64 bit dual thread processor.

The SPE's are capabile of dynamicly redistributing load and multiple cell chips can be dynamically linked and run distributed processing. So hook your home PC with one up to a TV with one and the PC will start to distribute graphics processing to the TV to maximise effeciency.

http://www.pcstats.com/articleview.cfm?articleID=1727

is an interesting read.

http://researchweb.watson.ibm.com/journal/rd/494/kahle.html
is another great article for the slightly more computer literate.

The thing that excites me is that the processor can redistribute load to group like processes together and minimize throughput within the chip and between other chips linked to it. This structure of specialization and clustering has been around for millions of years.....it's called a neuron.


so in other words: PS2 IS GOING TO KICK A$$!!:D :D
 
actually it already does.....PS3 uses cell.

Yes it should kick major ass, but this is only Gen I of the chip. Look at the Jump from Pentium 1 to Pentum 4 in around 20 years. Now advance cell 20 years....


In other news Sony annouced today they were forming a subsidiary company to handle R&D of cell technology. This new company is to be named Cyberdyne Technologies.
 
The difference between stock and say, AS5 isnt that great, the difference is only a few degrees C.

I dont know if any of you remember, but there was a thread here talking about a new thermal paste thats made up of mostly metal, and had a conductivity value of 82. Well MaximumPC did a test comparing them all, and the difference between the mostly metal compound and AS5 was very minimal, the metal one was only 2C colder at idle, and the same temp under load.
 
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